Din en 61340 pdf




















Din en 5 specifies technical requirements for the design, use and control of a protected din en 5 so that electrostatic sensitive devices ESDShaving sensitivity of V Human Body Model test or higher, can be handled with minimal risk of damage from procurement through to xin of life. Our expert spends a day with you on your site and sends you a comprehensive report. Although the term is widely used, it is better to avoid it if possible. Accept and continue Learn more about the cookies we use and how to change your settings.

It is not defined in The technical requirements of the standard cover The electrostatic protected area EPA including requirements for protective equipment, construction of the EPA, working practices, and field work Grounding and bonding systems Personal grounding Training requirements Compliance Verification test, measurement and auditing ESD protective packaging marking An Annex describes a small number of test methods to be used to verify the performance of equipment, materials and packaging for use in protection of ESDS.

Leesys is very pleased about din en 5 successful certification. Point-to-point din en 5 The is the resistance measured between two electrodes placed on a surface, defined inIEC There are three main requirements in which are concerned with planning and documenting the ESD program.

After priming with an environmentally friendly, water-emulsifiable 2-component epoxy resin layer, copper strands were laid as earthing elements. When you want an independent opinion on the state of your facility, or want to make improvements. There din en 5 also a requirement that an ESD Coordinator is appointed with responsibility for implementingthe requirements of the standard.

In most cases this is not din en 5 and on discharge is simply felt to be unpleasant so that the shock reflex represents the greatest potential hazard. If one of the materials has an insulating effect, high voltages occur on separation. IEC TR [9] provides guidance on the implementation of this standard. In electronics manufacturing, electrostatic discharges can lead to, for example, damage to din en 5 components. The technical requirements of the standard cover. Antistatic This can mean a wide variety of things, and is deprecated by the writers of Although the term is widely used, it is better to avoid it if possible.

When the electric field strength in air becomes sufficiently high, its insulating properties break down and charge can flow away in a rapid discharge. ESD can have very short duration high current levels and an cause ignition of flammable materials or damage to electronic components. An electronic component that could be damaged by ESD. An area in which static electricity is kept below levels that could cause damage to electronic components handled within the area.

Ground In the IEC , three types of ground are recognised, and may all be referred to as "ground". This is the usual method of connecting EPA ground to mains electrical safety earth.

In a case where no earth connection is available, it is sufficient to connect all ESD control items to a common connection point. It is not defined in Secondary packaging In IEC , this was defined as material used primarily to give additional physical protection to the outside of a proximity package. Low charging In IEC , this was defined as packaging exhibiting properties which minimises any charge generation.

Conductive The word "conductive" has a range of meanings within the context of different standards and should be treated with care. Within the old "electrostatic conductive" packaging material was defined to have surface resistance between 10 2 ohms and 10 5 ohms.

Dissipative The word "dissipative" has a range of meanings within the context of different standards and should be treated with care.

Within the , "electrostatic dissipative" packaging material was defined as having surface resistance between 10 5 ohms and 10 11 ohms. Electrostatic discharge shieldin g packaging Packaging, barrier or enclosure that limits the passage of ESD current and attenuates the energy resulting from an electrostatic discharge such that the maximum energy from 1 V HBM ESD applied to the outside of the packaging is less than or equal to 50 nJ measured inside the packaging.

Surface resistance This is the resistance of a surface measured by a concentric ring electrode test method defined in and IEC



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